Intel announced that its researchers foresee a way to make chips 10 times more dense through packaging improvements and a layer of a material that is just three atoms thick. And that could pave the way to putting a trillion transistors on a chip package by 2030.
Moore’s Law is supposed to be dead. Chips aren’t supposed to get much better, at least not through traditional manufacturing advances. That’s a dismal notion on the 75th anniversary of the invention of the transistor. Back in 1965, Intel chairman emeritus Gordon Moore predicted the number of components, or transistors, on a chip would double every couple of years.
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