Intel showed off circuit board advances that could keep Moore's Law on track.

Intel researchers see a path to trillion-transistor chips by 2030

Intel announced that its researchers foresee a way to make chips 10 times more dense through packaging improvements and a layer of a material that is just three atoms thick. And that could pave the way to putting a trillion transistors on a chip package by 2030.

Moore’s Law is supposed to be dead. Chips aren’t supposed to get much better, at least not through traditional manufacturing advances. That’s a dismal notion on the 75th anniversary of the invention of the transistor. Back in 1965, Intel chairman emeritus Gordon Moore predicted the number of components, or transistors, on a chip would double every couple of years.

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Dean Takahashi

Dean Takahashi is editorial director for GamesBeat. He has been a tech journalist since 1988, and he has covered games as a beat since 1996. He was lead writer for GamesBeat at VentureBeat from 2008 to April 2025. Prior to that, he wrote for the San Jose Mercury News, the Red Herring, the Wall Street Journal, the Los Angeles Times, and the Dallas Times-Herald. He is the author of two books, "Opening the Xbox" and "The Xbox 360 Uncloaked." He organizes the annual GamesBeat Next, GamesBeat Summit and GamesBeat Insider Series: Hollywood and Games conferences and is a frequent speaker at gaming and tech events. He lives in the San Francisco Bay Area.