Qualcomm announced advanced driving deals with four automotive brands at CES 2026, the big tech trade show in Las Vegas this week. And today it said the fourth one was with Hyundai Mobis.
Hyundai Mobis and Qualcomm announced that the companies have signed a comprehensive agreement at CES 2026 to co-develop next generation solutions for Software-Defined Vehicle (SDV) and Advanced Driver Assistance Systems (ADAS).
The memorandum of understanding (MOU) signing, held at the Hyundai Mobis booth at CES, was attended by Jung Soo-Kyung, executive vice president and head of Hyundai’s Automotive Electronics Business Unit, and Nakul Duggal, EVP for automotive, industrial and embedded IoT and robotics at Qualcomm.
Through this collaboration, Hyundai Mobis and Qualcomm Technologies will jointly develop integrated solutions tailored for emerging markets while pursuing broader global supply opportunities by leveraging the combination of Hyundai Mobis’s expertise in system integration, sensor fusion, and perception with Qualcomm Technologies’ leadership in system‑on‑chip (SoC) technology.
The companies will begin their work with their co‑development of advanced driving and parking solutions based on the Snapdragon Ride Flex system-on-chip (SoC). These innovations will target fast‑growing markets such as India, where ADAS adoption is expanding across vehicle segments alongside rising demand for SDV‑ready architectures.
For future SDV applications, they will also work together on next‑generation integrated solutions that combine Hyundai Mobis’s standardized software platform with Qualcomm Technologies’ Snapdragon automotive technologies to enhance performance, efficiency, and stability.