Lam Research unveils Vector Teos 3D tool for making AI chips

Lam Research unveiled Vector Teos 3D, a breakthrough deposition tool engineered specifically for the advanced packaging of next-generation chips for AI and high-performance computing.

Teos 3D is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration. It provides ultra-thick, uniform, inter-die gapfill, leveraging a proprietary bowed wafer handling approach, innovations in dielectric deposition, and enhanced monitoring by Lam Equipment Intelligence technology.