Semron is making AI chips more efficient with 3D packaging.
Semron is making AI chips more efficient with 3D packaging.
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Semron raises $7.9M for AI chips with 3D packaging

  • Posted byby Dean Takahashi
  • Updated
  • 3 min

Semron has raised $7.9 million (7.3 million euros) for AI chips with 3D packaging for mobile devices.

Dresden, Germany-based Semron said its goal is to set a new standard for AI chips in mobile devices, addressing the evolving needs of the industry.

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