Intel unveils glass substrates for chips to advance Moore’s Law

Intel said it has made a significant breakthrough in the development of glass substrates for next-generation advanced packaging in an attempt to stay on the past of Moore’s Law.

The big chip maker said this milestone achievement is set to redefine the boundaries of transistor scaling, enabling the realization of data-centric applications and propelling the advancement of Moore’s Law, which predicts that the number of transistors on a chip will double every couple of years. Intel said it should be able to make the jump to glass substrates by the end of the decade. The company made the announcement ahead of its Intel Innovation 2023 conference in San Jose, California this week.