Intel is using glass substrates to speed up chip communication.

Intel unveils glass substrates for chips to advance Moore’s Law

Intel said it has made a significant breakthrough in the development of glass substrates for next-generation advanced packaging in an attempt to stay on the past of Moore’s Law.

The big chip maker said this milestone achievement is set to redefine the boundaries of transistor scaling, enabling the realization of data-centric applications and propelling the advancement of Moore’s Law, which predicts that the number of transistors on a chip will double every couple of years. Intel said it should be able to make the jump to glass substrates by the end of the decade. The company made the announcement ahead of its Intel Innovation 2023 conference in San Jose, California this week.

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Dean Takahashi

Dean Takahashi is editorial director for GamesBeat. He has been a tech journalist since 1988, and he has covered games as a beat since 1996. He was lead writer for GamesBeat at VentureBeat from 2008 to April 2025. Prior to that, he wrote for the San Jose Mercury News, the Red Herring, the Wall Street Journal, the Los Angeles Times, and the Dallas Times-Herald. He is the author of two books, "Opening the Xbox" and "The Xbox 360 Uncloaked." He organizes the annual GamesBeat Next, GamesBeat Summit and GamesBeat Insider Series: Hollywood and Games conferences and is a frequent speaker at gaming and tech events. He lives in the San Francisco Bay Area.